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26/06/2006
Bosch to build new semiconductor fabrication plant in Reutlingen, near Stuttgart
The Bosch Group is investing 550 million euros in the construction of a new manufacturing facility for 200 millimetre semiconductors at its site in Reutlingen, near Stuttgart. Construction of the facility is to begin in the autumn of 2007. Rollout of production is planned for mid-2009. The plant will have a total capacity of up to 1,000 silicon wafers per day, equivalent to a daily production volume of up to one million microchips. 'In investing heavily in state-of-the-art manufacturing technology, we are securing the long-term future of our international automotive electronics business,' said Franz Fehrenbach, chairman of the bosch Board of Management. Bosch has been manufacturing 150 millimetre semiconductors in Reutlingern for 10 years now. The location can therefore draw on a wealth of expertise and has a good infrastructure. 
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